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atm multimode fiber transceivers for sonet oc-3/sdh stm-1 in low cost 1x9 package style data sheet features ? full compliance with atm forum uni sonet oc-3 multimode fiber physical layer specification ? multisourced 1 x 9 package style with choice of duplex sc or duplex st* receptacle ? wave solder and aqueous wash process compatibility ? manufactured in an iso 9002 certified facility applications ? multimode fiber atm backbone links ? multimode fiber atm wiring closet to desktop links ? atm 155 mbps/194 mbd encoded links (available upon special request) description the hfbr-5200 family of trans- ceivers from agilent technologies provide the system designer with products to implement a range of solutions for multimode fiber sonet oc-3 (sdh stm-1) physical layers for atm and other services. these transceivers are all supplied in the new industry standard 1x9 sip package style with either a duplex sc or a duplex st* connector interface. atm 2000 m backbone links the hfbr-5205/-5205t are 1300 nm products with optical performance compliant with the sonet sts-3c (oc-3) physical layer interface specification. this physical layer is defined in the atm forum user-network inter- face (uni) specification version 3.0. this document references the ansi t1e1.2 specification for the details of the interface for 2000 meter multimode fiber backbone links. selected versions of these transceivers may be used to implement the atm forum uni physical layer interface at the 155 mbps/194 mbd rate. the atm 100 mbps/125 mbd physical layer interface is best implemented with the hfbr-5100 family of fddi transceivers which are specified for use in this 4b/5b encoded physical layer per the fddi pmd standard. atm 500 m backbone and desktop links the hfbr-5204/-5204t are 1300 nm products which are similar to the hfbr-5205/5205t except that they are intended to provide a lower cost sonet oc-3 link to distances up to 500 meters in 62.5/125 m m multimode fiber optic cables. transmitter sections the transmitter sections of the hfbr-5204 and hfbr-5205 series utilize 1300 nm ingaasp leds. these leds are packaged in the optical subassembly portion of the transmitter section. they are driven by a custom silicon ic which converts differential pecl logic signals, ecl referenced (shifted) to a +5 volt supply, into an analog led drive current. hfbr-5204/-5204p/-5204t 1300 nm 500 m hfbr-5205/-5205a/-5205p/ -5205t 1300 nm 2 km *st is a registered trademark of at&t lightguide cable connectors.
2 figures 2b and 2c show the outline drawings for options that include mezzanine height and extended and flush shields respectively. the optical subassemblies utilize a high volume assembly process together with low cost lens elements which result in a cost effective building block. the electrical subassembly con- sists of a high volume multilayer printed circuit board on which the ic chips and various surface- mounted passive circuit elements are attached. the package includes internal shields for the electrical and optical subassemblies to insure low emi emissions and high immunity to external emi fields. the outer housing including the duplex sc connector or the duplex st ports is molded of filled non-conductive plastic to provide mechanical strength and electrical isolation. the solder posts of the agilent design are isolated from the circuit design of the transceiver and do not require connection to a ground plane on the circuit board. the transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts which exit the bottom of the housing. the two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with the duplex or simplex sc or st connectored fiber cables. note: the t in the product numbers indicates a transceiver with a duplex st connector receptacle. product numbers without a t indicate transceivers with a duplex sc connector receptacle. application information the applications engineering group in the agilent optical communication division is available to assist you with the technical understanding and design trade-offs associated with these transceivers. you can con- tact them through your agilent sales representative. figure 1. sc block diagram. data out signal detect out data in electrical subassembly quantizer ic driver ic top view pin photodiode duplex sc receptacle optical subassemblies led preamp ic differential single-ended differential receiver sections the receiver sections of the hfbr-5204 and hfbr-5205 series utilize ingaas pin photo- diodes coupled to a custom silicon transimpedance preampli- fier ic. these are packaged in the optical subassembly portion of the receiver. these pin/preamplifier combina- tions are coupled to a custom quantizer ic which provides the final pulse shaping for the logic output and the signal detect function. the data output is differential. the signal detect output is single-ended. both data and signal detect outputs are pecl compatible, ecl referenced (shifted) to a +5 volt power supply. package the overall package concept for the agilent transceivers consists of three basic elements; the two optical subassemblies, an electrical subassembly, and the housing as illustrated in the block diagrams in figure 1 and figure 1a. the package outline drawing and pin out are shown in figures 2, 2a, and 3. the details of this package outline and pin out are compliant with the multisource definition of the 1x9 sip. the low profile of the agilent transceiver design complies with the maximum height allowed for the duplex sc connector over the entire length of the package.
3 data out signal detect out data in electrical subassembly quantizer ic driver ic top view pin photodiode duplex st receptacle optical subassemblies led preamp ic differential single-ended differential figure 2. package outline drawing with standard height. figure 1a. st block diagram. 39.12 (1.540) max. area reserved for process plug 12.70 (0.500) 25.40 (1.000) max. 12.70 (0.500) 10.35 (0.407) max. + 0.25 - 0.05 + 0.010 - 0.002 3.30 ?0.38 (0.130 ?0.015) hfbr-5xxx date code (yyww) singapore 2.92 (0.115) 18.52 (0.729) 4.14 (0.163) 20.32 (0.800) [8x(2.54/.100)] 23.55 (0.927) 16.70 (0.657) 17.32 (0.682) 20.32 (0.800) 23.32 (0.918) 0.46 (0.018) note 1 (9x) note 1 0.87 (0.034) 23.24 (0.915) 15.88 (0.625) note 1: the solder posts and electrical pins are phosphor bronze with tin lead over nickel plating. dimensions are in millimeters (inches). 1.27 (0.050 + 0.08 - 0.05 + 0.003 - 0.002 0.75 (0.030 ) ) a 6.35 (0.250) 5.93 ?0.1 (0.233 ?0.004)
4 figure 2a. st package outline drawing with standard height. 25.4 (1.000) max. 24.8 (0.976) 42 (1.654) max. 5.99 (0.236) 12.7 (0.500) 12.0 (0.471) max. 0.5 (0.020) 3.3 ?0.38 (0.130) (?0.015) + 0.08 - 0.05 + 0.003 - 0.002 20.32 ?0.38 (?0.015) hfbr-5103t date code (yyww) singapore 3.2 (0.126) 2.6 (0.102) f 22.86 (0.900) 20.32 (0.800) [(8x (2.54/0.100)] 17.4 (0.685) 21.4 (0.843) 20.32 (0.800) 3.6 (0.142) 1.3 (0.051) 23.38 (0.921) 18.62 (0.733) note 1: phosphor bronze is the base material for the posts & pins with tin lead over nickel plating. dimensions in millimeters (inches). ( ( 0.46 (0.018) note 1 f + 0.25 - 0.05 + 0.010 - 0.002 ( ( 1.27 0.050
5 figure 2b. package outline drawing with mezzanine height and extended shield. 39.6 (1.56) max. area reserved for process plug 12.70 (0.50) 25.4 (1.00) max. 12.7 (0.50) 20.32 (0.800) 20.32 (0.800) dimensions are in millimeters (inches). all dimensions are ?0.025 mm unless otherwise specified. +0.1 -0.05 0.25 +0.004 -0.002 ( 0.010 3.3 ?0.38 (0.130 ?0.015) ) 20.32 (0.80) 0.51 (0.02) slot depth slot width 4.7 (0.185) 23.8 (0.937) +0.25 -0.05 0.46 +0.010 -0.002 ( 0.018 ) 9x ? 1.3 (0.051) 2x ? 15.8 ?0.15 (0.622 ?0.006) +0.25 -0.05 1.27 +0.010 -0.002 ( 0.050 ) 2x ? 2.0 ?0.1 (0.079 ?0.004) 29.6 (1.16) 8x 2.54 (0.100) 10.2 (0.40) 1.3 (0.05) max. 2.09 (0.08) uncompressed uncompressed 9.8 (0.386) max. a
6 figure 3. pin out diagram. 1 = v ee 2 = rd 3 = rd 4 = sd 5 = v cc 6 = v cc 7 = td 8 = td 9 = v ee top view n/c n/c rx tx figure 2c. package outline drawing with mezzanine height and flush shield. 39.6 (1.56) max. area reserved for process plug 12.7 (0.50) 25.4 (1.00) max. 12.7 (0.50) 20.32 (0.800) 20.32 (0.800) +0.1 -0.05 0.25 +0.004 -0.002 ( 0.010 3.3 ?0.38 (0.130 ?0.015) 2.54 (0.100) ) 20.32 (0.800) 2.2 (0.09) slot depth slot width 4.7 (0.185) 23.8 (0.937) +0.25 -0.05 0.46 +0.010 -0.002 ( 0.018 ) 9x ? 1.3 (0.051) 2x ? 15.8 ?0.15 (0.622 ?0.006) +0.25 -0.05 1.27 +0.010 -0.002 ( 0.050 ) 2x ? 2.0 ?0.1 (0.079 ?0.004) 14.4 (0.57) 29.7 (1.17) a dimensions are in millimeters (inches). all dimensions are ?0.025 mm unless otherwise specified. 8x 25.8 (1.02) max. 1.01 (0.40) 10.2 (0.40) max. 22.0 (0.87) area reserved for process plug 9.8 (0.386) max.
7 optical power budget (db) 0 fiber optic cable length (km) 0.5 1.5 2.0 2.5 12 10 8 6 4 2 1.0 0.3 hfbr-5205, 62.5/125 ? hfbr-5205, 50/125 ? hfbr-5204, 62.5/125 ? hfbr-5204, 50/125 ? agilent led technology has produced 1300 nm led devices with lower aging characteristics than normally associated with these technologies in the industry. the industry convention is 1.5 db aging for 1300 nm leds. the 1300 nm agilent leds are specified to experience less than 1 db of aging over normal commercial equipment mission life periods. contact your agilent sales representative for additional details. figure 4 was generated for the 1300 nm transceivers with an agilent fiber optic link model containing the current industry conventions for fiber cable specifications and the draft ansi t1e1.2. these optical parameters are reflected in the guaranteed performance of the transceiver specifications in this data sheet. this same model has been used extensively in the ansi and ieee committees, including the ansi t1e1.2 committee, to establish the optical performance requirements for various fiber optic interface standards. the cable parameters used come from the iso/iec jtc1/sc 25/wg3 generic cabling for customer premises per dis 11801 docu- ment and the eia/tia-568-a commercial building telecommunications cabling standard per sp-2840. transceiver signaling operating rate range and ber performance for purposes of definition, the symbol (baud) rate, also called signaling rate, is the reciprocal of the symbol time. data rate (bits/ sec) is the symbol rate divided by the encoding factor used to encode the data (symbols/bit). when used in 155 mbps sonet oc-3 applications the perform- ance of the 1300 nm transceivers, hfbr-5204/5205 is guaranteed to the full conditions listed in individual product specification tables. the transceivers may be used for other applications at signaling rates different than 155 mbps with some variation in the link optical power budget. figure 5 gives an indication of the typical performance of these products at different rates. these transceivers can also be used for applications which require different bit error rate (ber) performance. figure 6 illustrates the typical trade-off between link ber and the receivers input optical power level. the following information is provided to answer some of the most common questions about the use of these parts. transceiver optical power budget versus link length optical power budget (opb) is the available optical power for a fiber optic link to accommodate fiber cable losses plus losses due to in-line connectors, splices, optical switches, and to provide margin for link aging and unplanned losses due to cable plant reconfiguration or repair. figure 4 illustrates the predicted opb associated with the three transceivers series specified in this data sheet at the beginning of life (bol). these curves repre- sent the attenuation and chromatic plus modal dispersion losses associated with the 62.5/125 m m and 50/125 m m fiber cables only. the area under the curves represents the remaining opb at any link length, which is available for overcoming non-fiber cable losses. figure 4. optical power budget vs. fiber optic cable length.
8 bit error rate -6 4 1 x 10 -2 relative input optical power ?db -4 2 -2 0 1 x 10 -4 1 x 10 -6 1 x 10 -8 1 x 10 -10 1 x 10 -11 conditions: 1. 155 mbd 2. prbs 2 7 -1 3. center of symbol sampling. 4. t a = 25?c 5. v cc = 5 v dc 6. input optical rise/fall times = 1.0/2.1 ns. 1 x 10 -12 1 x 10 -9 1 x 10 -7 1 x 10 -5 1 x 10 -3 center of symbol hfbr-5204/5205 series figure 5. transceiver relative optical power budget at constant ber vs. signaling rate. figure 6. bit error rate vs. relative receiver input optical power. transceiver jitter performance the agilent 1300 nm transceivers are designed to operate per the system jitter allocations stated in table b1 of annex b of the draft ansi t1e1.2 revision 3 standard. the agilent 1300 nm transmitters will tolerate the worst case input electrical jitter allowed in annex b without violating the worst case output optical jitter requirements. the agilent 1300 nm receivers will tolerate the worst case input optical jitter allowed in annex b without violating the worst case output electrical jitter allowed. the jitter specifications stated in the following 1300 nm transceiver specification tables are derived from the values in table b1 of annex b. they represent the worst case jitter contribution that solder and wash process compatibility the transceivers are delivered with protective process plugs inserted into the duplex sc or duplex st connector receptacle. this process plug protects the optical subassemblies during wave solder and aqueous wash processing and acts as a dust cover during shipping. these transceivers are compatible with either industry standard wave or hand solder processes. shipping container the transceiver is packaged in a shipping container designed to protect it from mechanical and esd damage during shipment or storage. the transceivers are allowed to make to the overall system jitter without violating the annex b allocation example. in practice, the typical contribution of the agilent transceivers is well below these maximum allowed amounts. recommended handling precautions agilent recommends that normal static precautions be taken in the handling and assembly of these transceivers to prevent damage which may be induced by electrostatic discharge (esd). the hfbr-5200 series of transceivers meet mil-std-883c method 3015.4 class 2 products. care should be used to avoid shorting the receiver data or signal detect outputs directly to ground without proper current limiting impedance. transceiver relative optical power budget at constant ber (db) 0 200 0 signal rate (mbd) 25 75 100 125 2.5 2.0 1.5 1.0 175 0.5 50 150 conditions: 1. prbs 2 7 -1 2. data sampled at center of data symbol. 3. ber = 10 -6 4. t a = 25?c 5. v cc = 5 v dc 6. input optical rise/fall times = 1.0/2.1 ns. 0.5
9 board layout C decoupling circuit and ground planes it is important to take care in the layout of your circuit board to achieve optimum performance from these transceivers. figure 7 provides a good example of a schematic for a power supply decoupling circuit that works well with these parts. it is further recommended that a contiguous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. this recommen- dation is in keeping with good high frequency board layout practices. board layout C hole pattern the agilent transceiver complies with the circuit board common transceiver footprint hole pattern defined in the original multisource announcement which defined the 1x9 package style. this drawing is reproduced in figure 8 with the addition of ansi y14.5m compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. figure 7. recommended decoupling and termination circuits. no internal connection no internal connection hfbr-520x top view v ee rd rd sd v cc v cc td td v ee 123456789 c1 c2 l1 l2 r2 r3 r1 r4 c5 c3 c4 r9 r10 v cc filter at v cc pins transceiver r5 r7 r6 r8 c6 rd rd sd v cc td td termination at phy device inputs notes: the split-load terminations for ecl signals need to be located at the input of devices receiving those ecl signals. recommend 4-layer printed circuit board with 50 ohm microstrip signal paths be used. termination at transceiver inputs r1 = r4 = r6 = r8 = r10 = 130 ohms. r2 = r3 = r5 = r7 = r9 = 82 ohms. c1 = c2 = c3 = c5 = c6 = 0.1 ?. c4 = 10 ?. l1 = l2 = 1 ? coil or ferrite inductor. rx rx tx tx v cc v cc rx tx
10 board layout C art work the applications engineering group is developing gerber file art work for a multilayer printed circuit board layout incorporating the recommendations above. contact your local agilent sales representative for details. board layout C mechanical for applications interested in providing a choice of either a duplex sc or a duplex st con- nector interface, while utilizing the same pinout on the printed circuit board, the st port needs to protrude from the chassis panel a minimum of 9.53 nm for sufficient clearance to install the st connector. please refer to figure 8a for a mechanical layout detailing the recommended location of the duplex sc and duplex st transceiver packages in relation to the chassis panel. for both shielded design options, figures 8b and 8c identify front panel aperture dimensions. regulatory compliance these transceiver products are intended to enable commercial system designers to develop equipment that complies with the various international regulations governing certification of infor- mation technology equipment. see the regulatory compliance table for details. additional information is available from your agilent sales representative. electrostatic discharge (esd) there are two design cases in which immunity to esd damage is important. the first case is during handling of the transceiver prior to mounting it on the circuit board. it is important to use normal esd handling precautions for esd sensitive devices. these precau- tions include using grounded wrist straps, work benches, and floor mats in esd controlled areas. the second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. to the extent that the duplex sc connector is exposed to the outside of the equipment chassis it may be subject to whatever esd system level test criteria that the equipment is intended to meet. figure 8. recommended board layout hole pattern. (8x) 2.54 .100 20.32 .800 20.32 .800 1.9 ?0.1 .075 ?.004 (2x) 0.000 ma 0.8 ?0.1 .032 ?.004 (9x) 0.000 ma ? top view
11 electromagnetic interference (emi) most equipment designs utilizing these high speed transceivers from agilent will be required to meet the requirements of fcc in the united states, cenelec en55022 (cispr 22) in europe and vcci in japan. these products are suitable for use in designs ranging from a desktop computer with a single transceiver to a concentrator or switch product with large number of transceivers. in all well-designed chassis, the two 0.5" holes required for st connectors to protrude through, will provide 4.6 db more shielding than one 1.2" duplex sc rectangular cutout. thus, in a well-designed chassis, the duplex st 1x9 transceiver emissions will be identical to the duplex sc 1x9 transceiver emissions. immunity equipment utilizing these trans- ceivers will be subject to radio- frequency electromagnetic fields in some environments. these transceivers have a high immunity to such fields. for additional information regard- ing emi, susceptibility, esd and conducted noise testing proce- dures and results on the 1x9 transceiver family, please refer to applications note 1075, testing and measuring electro- magnetic compatibility performance of the hfbr- 510x/-520x fiber optic transceivers. 25.4 42.0 24.8 9.53 (note 1) 39.12 6.79 25.4 12.09 11.1 0.75 12.0 0.51 note 1: minimum distance from front of connector to the panel face. figure 8a. recommended common mechanical layout for st and st 1x9 connectored transceivers.
12 figure 8b. dimensions shown for mounting module with extended shield to panel. 0.43 27.4 ?0.50 (1.08 ?0.02) 9.4 (0.374) 6.35 (0.25) module protrusion + 0.02 ?0.01 10.9 + 0.5 ?0.25 () 2x 0.8 (0.032) 2x 0.8 (0.032) a pcb bottom view dimensions are in millimeters (inches). all dimensions are ?0.025 mm unless otherwise specified.
13 figure 8c. dimensions shown for mounting module flush to panel. 10.82 (0.426) 26.4 (1.04) 1.98 (0.078) 13.82 (0.544) 30.2 (1.19) 14.73 (0.58) keep out zone bottom side of pcb thicker panel will recess module. thinner panel will protrude module. 12.0 (0.47) 0.36 (0.014) 1.27 (0.05) optional septum dimensions are in millimeters (inches). all dimensions are ?0.025 mm unless otherwise specified. a
14 relative input optical power (db) 0 eye sampling time position (ns) -3 -1 0 1 5 4 3 2 3 1 -2 2 conditions: 1.t a = 25?c 2. v cc = 5 vdc 3. input optical rise/fall times = 1.0/2.1 ns. 4. input optical power is normalized to center of data symbol. 5. note 16 and 17 apply. hfbr-5204/-5205 series figure 10. relative input optical power vs. eye sampling time position. figure 9. transmitter output optical spectral width (fwhm) vs. transmitter output optical center wavelength and rise/fall times. regulatory compliance table feature test method performance electrostatic discharge mil-std-883c meets class 2 (2000 to 3999 volts) (esd) to the electrical method 3015.4 withstand up to 2200 v applied between electrical pins pins. electrostatic discharge variation of typically withstand at least 25 kv without damage (esd) to the duplex sc iec 801-2 when the duplex sc connector receptacle receptacle is contacted by a human body model probe. electromagnetic fcc class b transceivers typically provide a 13 db margin interference (emi) cenelec en55022 (with duplex sc receptacle) or a 9 db margin class b (cispr 22b) (with duplex st receptacles) to the noted vcci class 2 standard limits when tested at a certified test range with the transceiver mounted to a circuit card without a chassis enclosure. immunity variation of iec 801-3 typically show no measurable effect from a 10 v/m field swept from 10 to 450 mhz applied to the transceiver when mounted to a circuit card without a chassis enclosure. 200 100 l c ?transmitter output optical center wavelength ?m 1280 1300 1320 180 160 140 120 1360 1340 dl ?transmitter output optical spectral width (fwhm) ?m 1.0 1.5 2.5 3.0 2.0 hfbr-5205 transmitter test results of l c , dl and t r/f are correlated and comply with the allowed spectral width as a function of center wavelength for various rise and fall times. 1260 t r/f ?transmitter output optical rise/fall times ?ns 3.0
15 transceiver reliability and performance qualification data the 1 x 9 transceivers have passed agilent reliability and performance qualification testing and are undergoing ongoing quality monitoring. details are available from your agilent sales representative. these transceivers are manufactured at the agilent singapore location which is an iso 9002 certified facility. ordering information the hfbr-5204/-5204p/-5204t and hfbr-5205/-5205a/-5205p/ -5205t 1300 nm transceivers are available for production orders through the agilent component field sales offices and authorized distributors world wide. *for extended shield and flush shield options, please contact field sales offices and authorized distributors world wide. applications support materials contact your local agilent component field sales office for information on how to obtain pcb layouts, test boards and demo boards for the 1x9 transceivers. evaluation kits agilent has available three evaluation kits for the 1x9 transceivers. the purpose of these kits is to provide the necessary materials to evaluate the perform- ance of the hfbr-520x family in a pre-existing 1x13 or 2x11 pinout system design configura- tion or when connectored to various test equipment. 1. hfbr-0319 C evaluation test fixture board: this test fixture converts +5 v ecl 1x9 transceivers to C5 v ecl bnc coax connections so that direct connections to industry standard fiber optic test equipment can be accomplished. accessory duplex sc connectored cable assemblies agilent recommends for optimal coupling the use of flexible-body duplex sc connectored cable. accessory duplex st connectored cable assemblies agilent recommends the use of duplex push-pull st connectored cable for optimal repeatibility of the optical power coupling. hfbr-520 x y z z = > e = extended shield f = flush shield transceiver x => 4 = 1300 nm, 500 m 5 = 1300 nm, 2 km receptacle y => blank = sc receptacle a = extended temp. range (-40 c to +85 c) p = mezzanine height t = st receptacle
16 hfbr-5204, and -5205 series recommended operating conditions parameter symbol min. typ. max. unit reference ambient operating temperature* t a 070 c supply voltage v cc 4.75 5.25 v data input voltage - low v il - v cc -1.810 -1.475 v data input voltage - high v ih - v cc -1.165 -0.880 v data and signal detect output load r l 50 w note 2 hfbr-5204, and -5205 series absolute maximum ratings parameter symbol min. typ. max. unit reference storage temperature t s -40 100 c lead soldering temperature t sold 260 c lead soldering time t sold 10 sec. supply voltage v cc -0.5 7.0 v data input voltage v i -0.5 v cc v differential input voltage v d 1.4 v note 1 output current i o 50 ma *applies to hfbr-5204 and 5205 series except for hfbr-5205a. ambient operating temp. for hfbr-5205a is min. -40 c and max. 85 c.
17 hfbr-5204 and -5205 series transmitter electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v)* parameter symbol min. typ. max. unit reference supply current i cc 145 185 ma note 3 power dissipation p diss 0.76 0.97 w data input current - low i il -350 0 m a data input current - high i ih 14 350 m a hfbr-5204 and -5205 series receiver electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v)* parameter symbol min. typ. max. unit reference supply current i cc 82 145 ma note 4 power dissipation p diss 0.3 0.5 w note 5 data output voltage - low v ol - v cc -1.840 -1.620 v note 6 data output voltage - high v oh - v cc -1.045 -0.880 v note 6 data output rise time t r 0.35 2.2 ns note 7 data output fall time t f 0.35 2.2 ns note 7 signal detect output voltage - low v ol - v cc -1.840 -1.620 v note 6 signal detect output voltage - high v oh - v cc -1.045 -0.880 v note 6 signal detect output rise time t r 0.35 2.2 ns note 7 signal detect output fall time t f 0.35 2.2 ns note 7 *applies to hfbr-5204 and 5205 series except for hfbr-5205a. t a for hfbr-5205a is -40 c and 85 c. *applies to hfbr-5204 and 5205 series except for hfbr-5205a. t a for hfbr-5205a is -40 c and 85 c.
18 hfbr-5204/-5024p/-5204t receiver optical and electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference input optical power p in min. (w) -29 dbm avg. note 15 minimum at window edge figure 10 input optical power p in min. (c) -30 dbm avg. note 16 minimum at eye center figure 10 input optical power maximum p in max. -14 dbm avg. note 15 systematic jitter contributed sj 0.2 1.2 ns p-p note 17 by the receiver random jitter contributed rj 1 1.91 ns p-p note 18 by the receiver operating wavelength l 1270 1380 nm signal detect - asserted p a p d + 1.5 db -31 dbm avg. note 19 signal detect - deasserted p d -45 dbm avg. note 20 signal detect - hysteresis p a - p d 1.5 db signal detect assert time 0 55 100 m s note 21 (off to on) signal detect deassert time 0 110 350 m s note 22 (on to off) hfbr-5204/-5024p/-5204t transmitter optical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference output optical power bol p o -21 -14 dbm avg. note 8 62.5/125 m m, na = 0.275 fiber eol -22 output optical power bol p o -24.5 -14 dbm avg. note 8 50/125 m m, na = 0.20 fiber eol -25.5 optical extinction ratio 0.03 % note 9 -35 db output optical power at p o (0) -45 dbm avg. note 10 logic 0 state center wavelength l c 1270 1310 1380 nm spectral width - fwhm dl 250 nm note 11 - nm rms 107 nm rms optical rise time t r 4 ns note 12 optical fall time t f 4 ns note 12 systematic jitter contributed sj 0.04 1.2 ns p-p note 13 by the transmitter random jitter contributed rj 0 0.52 ns p-p note 14 by the transmitter
19 hfbr-5205/-5205a/-5205p/-5205t transmitter optical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v)* parameter symbol min. typ. max. unit reference output optical power bol p o -19 -14 dbm avg. note 8 62.5/125 m m, na = 0.275 fiber eol -20 output optical power bol p o -22.5 -14 dbm avg. note 8 50/125 m m, na = 0.20 fiber eol -23.5 optical extinction ratio 0.001 0.03 % note 9 -50 -35 db output optical power at p o ("0") -45 dbm avg. note 10 logic "0" state center wavelength l c 1270 1310 1380 nm note 23 figure 9 spectral width C fwhm dl 137 nm note 23 C nm rms 58 nm rms figure 9 optical rise time t r 0.6 1.0 3.0 ns note 11, 23 figure 9 optical fall time t f 0.6 2.1 3.0 ns note 11, 23 figure 9 systematic jitter contributed sj 0.04 1.2 ns p-p note 13 by the transmitter random jitter contributed rj 0 0.52 ns p-p note 14 by the transmitter *applies to 5205 series except for hfbr-5205a. t a for hfbr-5205a is -40 c and 85 c.
20 hfbr-5205/-5205a/-5205p/-5205t receiver optical and electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v)* parameter symbol min. typ. max. unit reference input optical power p in min. (w) -30 dbm avg. note 15 minimum at window edge figure 10 input optical power p in min. (c) -31 dbm avg. note 16 minimum at eye center figure 10 input optical power maximum p in max. -14 dbm avg. note 15 operating wavelength l 1260 1360 nm systematic jitter contributed sj 0.2 1.2 ns p-p note 17 by the receiver random jitter contributed rj 1 1.91 ns p-p note 18 by the receiver signal detect - asserted p a p d + 1.5 db -31 dbm avg. note 19 signal detect - deasserted p d -45 dbm avg. note 20 signal detect - hysteresis p a - p d 1.5 db signal detect assert time 0 55 100 m s note 21 (off to on) signal detect deassert time 0 110 350 m s note 22 (on to off) notes: 1. this is the maximum voltage that can be applied across the differential transmitter data inputs to prevent damage to the input esd protection circuit. 2. the outputs are terminated with 50 w connected to v cc -2 v. 3. the power supply current needed to operate the transmitter is provided to differential ecl circuitry. this circuitry maintains a nearly con- stant current flow from the power supply. constant current operation helps to prevent unwanted electrical noise from being generated and conducted or emitted to neighboring circuitry. 4. this value is measured with the outputs terminated into 50 w connected to v cc -2 v and an input optical power level of -14 dbm average. 5. the power dissipation value is the power dissipated in the receiver itself. power dissipation is calcu- lated as the sum of the products of supply voltage and currents, minus the sum of the products of the output voltages and currents. 6. this value is measured with respect to v cc with the output terminated into 50 w connected to v cc -2 v. 7. the output rise and fall times are measured between 20% and 80% levels with the output connected to v cc -2 v through 50 w . 8. these optical power values are measured with the following conditions: ? the beginning of life (bol) to the end of life (eol) optical power degradation is typically 1.5 db per the industry conven- tion for long wavelength leds. the actual degradation observed in agilents 1300 nm led products is <1 db, as specified in this datasheet. ? over the specified operating voltage and temperature ranges. ? with 25 mbd (12.5 mhz square- wave) input signal. ? at the end of one meter of noted optical fiber with cladding modes removed. the average power value can be converted to a peak power value by adding 3 db. higher output optical power transmitters are available on special request. 9. the extinction ratio is a measure of the modulation depth of the optical signal. the data 0 output optical power is compared to the data 1 peak output optical power and expressed as a percentage. with the transmitter driven by a 25 mbd (12.5 mhz square-wave) input signal, the average optical power is measured. the data 1 peak power is then calculated by adding 3db to the measured average optical power. the data 0 output optical power is found by measuring the optical power when the transmitter is driven by a logic 0 input. the extinction ratio is the ratio of the optical power at the 0 level compared to the optical power at the 1 level expressed as a percentage or in decibels. *applies to 5205 series except for hfbr-5205a. t a for hfbr-5205a is -40 c to 85 c.
21 10. the transmitter will provide this low level of output optical power when driven by a logic 0 input. this can be useful in link troubleshooting. 11. the relationship between full width half maximum and rms values for spectral width is derived from the assumption of a gaussian shaped spectrum which results in a 2.35 x rms = fwhm relationship. 12. the optical rise and fall times are measured from 10% to 90% when the transmitter is driven by a 25 mbd (12.5 mhz square-wave) input signal. the ansi t1e1.2 committee has designated the possibility of defining an eye pattern mask for the transmitter optical output as an item for further study. agilent will incorporate this requirement into the specifications for these products if it is defined. the hfbr-5204 and hfbr-5205 products typically comply with the template require- ments of ccitt (now itu-t) g.957 section 3.2.5, figure 2 for the stm- 1 rate, excluding the optical receiver filter normally associated with single mode fiber measurements which is the likely source for the ansi t1e1.2 committee to follow in this matter. 13. systematic jitter contributed by the transmitter is defined as the com- bination of duty cycle distortion and data dependent jitter. systematic jitter is measured at 50% threshold using a 155.52 mbd (77.5 mhz square-wave), 2 7 - 1 psuedorandom data pattern input signal. 14. random jitter contributed by the transmitter is specified with a 155.52 mbd (77.5 mhz square- wave) input signal. 15. this specification is intended to indicate the performance of the receiver section of the transceiver when input optical power signal characteristics are present per the following definitions. the input optical power dynamic range from the minimum level (with a window time-width) to the maximum level is the range over which the receiver is guaranteed to provide output data with a bit error ratio (ber) better than or equal to 1 x 10 -10 . ? at the beginning of life (bol) ? over the specified operating temperature and voltage ranges ? input is a 155.52 mbd, 2 23 - 1 prbs data pattern with 72 1s and 72 0s inserted per the ccitt (now itu-t) recommenda- tion g.958 appendix i. ? receiver data window time-width is 1.23 ns or greater for the clock recovery circuit to operate in. the actual test data window time- width is set to simulate the effect of worst case optical input jitter based on the transmitter jitter values from the specification tables. the test window time- widths are as follows: hfbr-5205 and hfbr-5204 are 3.32 ns. ? transmitter operating with a 155.52 mbd, 77.5 mhz square- wave, input signal to simulate any cross-talk present between the transmitter and receiver sections of the transceiver. 16. all conditions of note 15 apply except that the measurement is made at the center of the symbol with no window time-width. 17. systematic jitter contributed by the receiver is defined as the combina- tion of duty cycle distortion and data dependent jitter. systematic jitter is measured at 50% threshold using a 155.52 mbd (77.5 mhz square-wave), 2 7 - 1 psuedorandom data pattern input signal. 18. random jitter contributed by the receiver is specified with a 155.52 mbd (77.5 mhz square-wave) input signal. 19. this value is measured during the transition from low to high levels of input optical power. 20. this value is measured during the transition from high to low levels of input optical power. 21. the signal detect output shall be asserted within 100 m s after a step increase of the input optical power. 22. signal detect output shall be de- asserted within 350 m s after a step decrease in the input optical power. 23. the hfbr-5205 transceiver complies with the requirements for the tradeoffs between center wave- length, spectral width, and rise/fall times shown in figure 9. this figure is derived from the fddi pmd standard (iso/iec 9314-3 : 1990 and ansi x3.166 - 1990) per the description in ansi t1e1.2 revision 3. the interpretation of this figure is that values of center wavelength and spectral width must lie along the appropriate optical rise/fall time curve.
www.semiconductor.agilent.com data subject to change. copyright ? 2001 agilent technologies, inc. november 2, 2001 obsoletes 5988-1576en 5988-4379en

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